A Breakthrough in Logic Design Drastically Improving Performances from 65 55 nm LP and BelowTSMC 2012 Open Innovation Platform® Ecosystem ForumE.Bernard-Moulin, I.Sever
Paper available for download on TSMC website
Conference papers
Novel Low-Power Audio CODEC from 180nm to 28nm with Moore and More!TSMC 2012 Open Innovation Platform® Ecosystem ForumF.Renoux, H.Kuo, H.L.Wang
Paper available for download on TSMC website
COMON – The European Compact Modeling NetworkAdvance Program IWCM, Yokohama, JapanW.Grabinski, B.Iniguez, J.M.Sallese, A.Bazigos, D.Tomaszewski, M.Yakupov, G.Depeyrot
COMON – The European Compact Modeling Network Advance Programm IWCM, Jan. 25, 2011, Yokohama, Japan W. Grabinski, B. Iniguez, J.-M. Sallese, A. Bazigos, D. Tomaszewski, M. Yakupov, G. Depeyrot Index Terms — Compact modeling, SPICE, Verilog-A, analog/RF IC CMOS, multiple-gate MOSFET, IIIV HEMT, HV MOSFET, Monte-Carlo analysis, statistical modeling COMON is the European FP7 Marie-Curie
Silicon Qualified SuperViC: the only way to safe SoC integrationICCAD 2010, in Wuxi, ChinaW.Guo, L.Engels
Introduction System integrators often encounter problems on application boards too late in the design cycle, when bringing together Virtual Components (ViCs of silicon IPs) into a system. Some ViC performances may be degraded at higher levels (SoC and PCB), and thus the final system does not perform as well as expected. In other words, assembling
SMASH: a Verilog-A simulator for analog designersMOS-AK 2010, Sept. 17 2010 in SevillaG.Depeyrot, F.Poullet, B.Dumas
SMASH: a Verilog-A simulator for analog designers MOS-AK 2010, Sept. 17 2010 in Sevilla Gilles DEPEYROT & Frédéric POULLET & Benoît DUMAS With the SPICE compatibility extensions of the Verilog-AMS Language Reference Manual, Verilog-A has the potential to revolutionize the paradigm of analog design of integrated circuits and totally replace SPICE. The achievement of this
