Category: News releases

Dolphin Integration announces its participation to the TSMC Open Innovation Platform® (OIP) Forum at the Santa Clara Convention Center, CA. During the event Gilles Depeyrot, CEO of Dolphin Integration, will present a breakthrough low-power design methodology associated with a set of standardized Virtual Components of Silicon IP enabling to optimize low power networks in a …

Advanced low-power solutions will be revealed at the TSMC 2015 OIP Forum Read More »

Relying on 30 years of experience in SoC design, Dolphin Integration has developped all the IP contributors for an ultra-low-power SoC, in partnership with TSMC, particularly relevant for IoT applications. Extreme reduction of power consumption of a whole SoC requires a power domain architecture, a truly complex task for SoC integrators. To reach this objective, …

Build an ultra low power SoC thanks to implementation-ready solutions Read More »

Dolphin Integration today announced a collaborative effort with TSMC to ease the design and optimization of Internet of Things (IoT) subsystems for System-on-Chip (SoC) integrators. Ultra-low power requirements combined with shortened time-to-market windows highlight the needs to reduce design methodology complexity and to simplify Silicon IP component integration. Leveraging TSMC’s ultra-low power technology, Dolphin Integration …

Dolphin Integration and TSMC collaborate on Low-Power IoT Subsystem Design Read More »

As they operate only 1 % of their battery life in active mode, the major challenge of IoT applications turns to lowering the power consumption during the deep-sleep mode. In this latter operating mode, circuit architects face the challenge of achieving a power consumption as low as few micro-amperes, while preserving data retention and supplying always-on …

Unveiling of ultra-low quiescent-current regulator for IoT Systems-on-Chip at 55 nm Read More »

A safe and flexible solution to build the most efficient power islands proves to be essential but challenging for all SoC designs to enable optimized Low-Power management. To guarantee the safe construction of power islands for the lowest power consumption, Dolphin Integration proposes an innovative power island construction kit called CLICK, which includes a variety …

Innovative power island construction kit optimizes Low-Power Management Read More »

Dolphin Integration is proud to roll out sCODa-MT1-LR.01, a stereo audio CODEC supporting both analog and digital microphones. With its architecture, this audio Virtual Component of Silicon IP is the perfect candidate for SoCs targeting wireless audio devices, such as Bluetooth speakers or sound bars, where sound performance and die cost are pivotal. This product …

Reduction of silicon area by 40 % on the new audio codecs targeting wireless devices Read More »

Decreasing the power consumption of SoCs is an ever-increasing challenge that requires power optimization of each individual subsystem. Dolphin Integration proposes the SESAME BIV standard cell library to answer the need for ultra-low power always-on blocks. SESAME BIV is a patented standard cell library available from 180 nm down to 55 nm. It takes advantage …

SESAME BIV standard cell library: ultra low-power solution for always-on blocks Read More »

Dolphin Integration is proud to announce the availability of its RISC-351 Zephyr microcontroller. It enables 80×51 users to benefit from 32-bit microcontroller performances while leveraging the i51 legacy of peripherals and software. The number of applications which require high processing power with low power consumption is on a sharp rise. A number of contenders claim …

The i8051 legacy extended with 32-bit RISC microcontrollers Read More »

Dolphin Integration is proud to announce that their memory offering at 90 nm eFlash process have fully passed the various stages of TSMC 9000 qualification. This guarantees innovative solutions with minimal risks and maximum reliability. Dolphin Integration’s SpRAM RHEA, 1PRFile AURA, 2PRFile/DpRAM ERIS and sROMet PHOENIX are silicon proven to support smartcard, home application and …

Memories silicon proven at TSMC 90 nm eFlash Read More »