News releases Archives - Accelerate Energy Efficient SoC designs

Dolphin Design announces partnership with Fraunhofer IIS to enhance power management in edge AI

Dolphin Design announces a new strategic partnership with the Fraunhofer Institute for Integrated Circuits IIS, a research Institute and member of the European Union’s PREVAIL project consortium. This collaboration aims to push the boundaries of power management in next-generation edge AI (Artificial Intelligence) technologies. Grenoble, France and Erlangen, Germany | August 27, 2024 – Dolphin Design […]

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Catch the replay of the recent webinar with Synopsys

Catch the replay of our recent webinar with Synopsys We are excited to share the replay of our insightful webinar about “Synergized Innovation, Integration BLE RF PHY with Power Management“. Our expert speakers, Charles Dittmer – Sr. Product Manager, Wireless IP at Synopsys and Hakim Jaafar – VP Marketing and Application Lab at Dolphin Design,

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Dolphin Design teams up with Raspberry Pi for advanced chip power management

Dolphin Design and Raspberry Pi are proud to announce a groundbreaking partnership that leverages Dolphin’s cutting-edge power management solutions in the development of Raspberry Pi’s chip technology. Using TSMC’s robust process, this collaboration aims to enhance performance and efficiency, setting new standards in semiconductor design. Grenoble, France | May 27, 2024 – In a groundbreaking move

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Dolphin Design integrates JIRA, a new era of customer service excellence

Dolphin Design integrates JIRA, a new era of customer service excellence We are thrilled to announce that Dolphin Design is embracing a new era of customer service excellence – we are moving to Jira Customer Support! By integrating Jira into our support workflow, we’re ensuring that the queries are tracked and resolved more efficiently than

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Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry’s Supply Chain

Dolphin Design, a pioneer in silicon IPs specializing in power-management, Audio and Very Edge Computing with AI capabilities, announces it is expanding its GoASIC! Program to enhance the semiconductor industry. Grenoble, France | April 18th, 2024 – Dolphin Design’s GO ASIC program addresses a critical concern in the semiconductor sector: ensuring timely product delivery. Most fabless

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Dolphin Design announces the signature of an Industrial Chair with 3IA Côte d’Azur

Early February, during the event WAICF in Cannes (France), Vincent Huard, CTO at Dolphin Design, has signed the first Industrial Chair with 3IA Côte d’Azur, for a 4-year period. This is a new collaborative tool for research and innovation, placed here in the context of Edge AI for low-energy artificial intelligence. The chair is headed

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Kudelski IoT and Dolphin Design unite to accelerate secure ASIC and IP projects

Partnership strengthens protection against cyberattacks and safeguards intellectual property and trade secrets. Cheseaux-sur-Lausanne, Switzerland and Grenoble, France – March 19, 2024 – Kudelski IoT, a division of the Kudelski Group, a global leader in digital security and IoT solutions, together with Dolphin Design, announce a collaboration aiming to simplify the development of highly secure ASIC

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Dolphin Design in Arm’s Partner Catalog

Dolphin Design can now be found in the Arm Partner Catalog! You’ll find Dolphin Design among a diverse range of industry leaders offering support across markets and geographies. It lists reliable and expert partners to design and develop your projects. Being a qualified Arm Design Partner provides Dolphin Design with the access to IP, tools and technical

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Dolphin Design announces the successful launch of its first silicon tape out in 12nm FinFet.

This test chip is the first of its kind to offer a complete solution for audio IPs in 12 nm FinFet (FF) technology. It combines high-performance, low-power and, optimized silicon footprint to deliver superior sound quality and functionality targeting battery powered application. This dedicated test- chip reaffirms Dolphin Design leadership in mixed signal IPs, inspiring

Dolphin Design announces the successful launch of its first silicon tape out in 12nm FinFet. Read More »

[Press Release] Dolphin Design enables Orca’s RF SoCs for direct-to-satellite communications

Grenoble, August 1, 2023. Dolphin Design, a leader in semiconductor IP solutions for power management, audio, and processing with ASIC design services, announces today it has partnered with Orca Systems, a fabless semiconductor company for the development of ORC3990, a highly integrated wireless system-on-chip (SoC) to provide Internet of Things (IoT) connectivity over satellite and

[Press Release] Dolphin Design enables Orca’s RF SoCs for direct-to-satellite communications Read More »

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