Category: News releases

Unveiling of our innovative Energy Efficient Platforms, complete turnkey solutions for competitive SoC designs

Grenoble, France – May 4th, 2020 Today, we unveil our new System Platforms for Energy Efficient SoC Design – SPEED – which enable competitive SoCs to be designed with outstanding energy efficiency figures. Energy efficiency is the key metric to optimize for next generation SoCs, to make devices smarter, smaller, faster, less power consuming, and …

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We are attacking the Taiwanese and Japanese markets with an exclusive sales representative

Grenoble, March 30th, 2020 To fuel our growth and to support our growing number of users looking for ultra-low power semiconductor IPs and design platforms, we have appointed a sales representative to take care of our interests in Taiwan and Japan. Shui Shou Wang is Taiwanese and has 22 years of international experience in the …

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How to multiply by 18 battery life of voice control devices?

Grenoble, December 16th, 2019 A disruptive Voice Activity Detection (VAD) solution is now available. The consumer trend for high-tech accessories is demanding, as mandatory, voice interaction with smart electronic products. Everything needs to be voice activated – from the car up to the light bulbs and the earables. Voice control devices, such as True Wireless …

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Live webinar from Dolphin Design: Pushing the limit of SoC energy efficiency with a NEW secret technique

The explosion of intelligent IoT devices and connected vehicles, supported by a fast-growing communication and processing infrastructure, is creating an exponential demand for energy. If we want to properly use our limited resources, energy saving must be considered as our main innovation focus. When it comes to IC design, we can distinguish the two following …

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INGChips selects Dolphin Integration’s Power Management IP Platform for its ultra Low Power Bluetooth Low-Energy SoC in 40 nm eFlash

Dolphin Integration, a leading provider of semiconductor IP, announced today that INGChips, a fabless semiconductor company that focuses on ultra low power IoT wireless SoC, has selected Dolphin Integration’s comprehensive set of Power Management IPs for INGChips’ Bluetooth Low-Energy (BLE) SoC in 40 nm with embedded Flash memory. Leveraging Dolphin Integration’s unique modular IP platform …

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GLOBALFOUNDRIES and Dolphin Integration to Deliver Differentiated FD-SOI Adaptive Body Bias Solutions for 5G, IoT and Automotive Applications

IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration GLOBALFOUNDRIES (GF) and Dolphin Integration, a leading provider of semiconductor IP, today announced a collaboration to develop a series of adaptive body bias (ABB) solutions to improve the energy efficiency and reliability of system-on-chip (SoC) on GF’s 22nm FD-SOI (22FDX®) process technology …

GLOBALFOUNDRIES and Dolphin Integration to Deliver Differentiated FD-SOI Adaptive Body Bias Solutions for 5G, IoT and Automotive Applications Read More »

TDK-Micronas renews its trust in Dolphin Integration’s RAM and ROM Silicon IPs

TDK-Micronas, a TDK group company and the most preferred partner for sensing and control, has renewed its trust in Dolphin Integration’s low power and dense RAM and ROM for its 3D Hall magnetic sensor products. TDK-Micronas is a renowned company on the automotive market, especially for its world´s largest Hall sensor portfolio covering all automotive …

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