News releases Archives - Page 16 of 20 - Accelerate Energy Efficient SoC designs

myMPW+ : a complementary offer targeting ST65nm process

Dolphin Design confirms the strengthening of their partnership with STMicroelectronics and the growth of their Custom Fabless activity by going to the next step in their offering of Multi-Project Wafer: myMPW+. Complementary to general purpose Grenoble offering from the CMP (Circuits Multi-Projets), myMPW+ consists in a secured Multi-Project Wafer run yearly at STMicroelectronics in 65nmLP, …

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Renewal of CIR agreement

Dolphin Intégration a reçu du Ministère de l’Enseignement Supérieur et de la Recherche la notification du renouvellement de son agrément CIR (Crédit Impôt Recherche) pour les années 2014, 2015 et 2016. Les travaux confiés aux équipes de Dolphin Intégration pour la conception de vos circuits ASIC/SoC innovants sont donc éligibles à votre assiette CIR. Télécharger …

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Dolphin Integration announces groundbreaking regulators for multi-mode optimization of consumption

Dolphin Integration, leader in embedded power management IP, today announced the Retention Alternating Regulator (RAR) as a fully integrated, secure and power-efficient solution for supplying loads requiring multi-mode optimization, with a low Bill-of-Material. Applications running up to years on battery require, on the one hand, high efficiency in normal mode due to large power dissipation …

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Dolphin Integration launches new AHB compliant Cache controller to meet growing demand for both energy efficient and faster SoC with NVM

With the goal of improving drastically the PPA mix (Power x Performance x Area) of Non Volatile Memories (NVM) like eFlash or EEPROM, Dolphin Integration announces today R-Stratus-LP, new generation of cache controller. R-Stratus-LP provides advanced NVM based devices architecture with outstanding gains: Power consumption of embedded or external NVM may be divided by 3X …

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Dolphin Integration at the Forum DGA Innovation

Dolphin Integration present their positioning in the Custom Fabless activity as highlighted within the EDA SoC project of the European Defense Agency. Acting as prime contractor, Dolphin Integration may allow customers to accede to foundries for their ASIC/SoC for industrial, aeronautical and military markets regardless of their fabrication volumes. Such an offering, gathering all expertises …

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Dolphin Integration PWM audio DAC at 55 nm densest ever for STB and wireless audio devices

Dolphin Integration rolls out sDACa-MT1.01, an ultra dense Pulse Width Modulated DAC for audio applications embedding valuable features for easier SoC integration while supporting sound amplifiers with both analog and digital inputs: Support both line-out and power amplifiers Anti Pop-up Noise control signal Spread-spectrum feature for safe integration with RF emitter/receiver PLL-less feature to prevent …

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Dolphin Integration announces even denser 6-Track standard cells to decrease power consumption at 180/130 nm

Dolphin Integration, the innovator of Virtual Components for optimizing power-consumption and density of subsystems, today announces the latest generation of 6-Track standard cell libraries in mature processes, with enhanced features to enable further power and area savings with also timing improvements. Designed around ultra dense sequential cells, celebrated as the patented spinner cell system, this …

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Dolphin Integration offers first standard cell library to enable a leakage reduction of 1/350 at 65 and 55 nm

Dolphin Integration, the innovator of Virtual Components for density and power optimized subsystems, announces the SESAME BIV standard cell library as a major innovation for ultra low leakage always-on logic block. SESAME BIV standard cell library extends the RCSL offer (Reduced Cell Stem Libraries) by delivering a leakage reduction of 1/350 for a silicon footprint …

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Dolphin Integration enriches its line of 80251 with a new DMA for high density and robustness

Dolphin Integration presents a new peripheral to extend its wide offer for 80251 and 8051 microcontroller. The FlipDMA is proposed with many features, while presenting a small area of 0.03 mm2 for 2 channels on TSMC 0.18 µm G: Choice of number of channels 3 functional transfer modes: burst, alternate cycle, single byte optional features …

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Dolphin integration announces one million of circuits sold over the last two years

Dolphin Integration confirm the growth of their Custom Fabless activity for industrial, aeronautical and military markets with the delivery of more than a million devices since June 2011. For the leader in Silicon IP for dense and low-consumption circuits, Custom Fabless Products serve to demonstrate their experience in solving, ahead of any competition, the practical …

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