News releases Archives - Page 16 of 19 - Accelerate Energy Efficient SoC designs

New partnerships strengthen the position as prime contractor of Dolphin Integration for the design, the fabrication and the test of custom ASIC/SoC circuits

Dolphin Integration benefit from more than 25 years of experience in providing with: Virtual components of Immaterial Propriety (Silicon IPs like MCU, standard cells, memories, high-resolution converters) Design services (on-demand ASICs/SoCs, migration from FPGA to ASIC, etc.) Dolphin profile themselves as prime contractor in a genuine "one-stop shop" model by taking in charge the wholeness …

New partnerships strengthen the position as prime contractor of Dolphin Integration for the design, the fabrication and the test of custom ASIC/SoC circuits Read More »

Dolphin Integration launches the kit of cells to build islets of the second generation

Dolphin Integration is releasing SESAME CLICK, a kit of cells enabling the construction and integration of islets. Its low power cells optimized for TSMC 65 nm and 55 nm processes is enriched with a patented Transition Ramp Cell for an easy and safe construction of low energy circuits. SESAME CLICK minimizes power consumption through: Support …

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IcyHeart EU project launch: Highly integrated ultra-low-power SoC solution for unobtrusive and energy-efficient wireless cardiac monitoring

New technology consortium set to change relationship between patients and doctors through innovative tele-health care solutions. EU, researchers, and industry leaders seek to deliver unobtrusive wireless battery powered ECG monitoring solution for ambulatory use with the ability to analyze the ECG waveform and detect abnormal events in real time. IcyHeart is a European project co-funded …

IcyHeart EU project launch: Highly integrated ultra-low-power SoC solution for unobtrusive and energy-efficient wireless cardiac monitoring Read More »

Microdul Adopts Advanced Mixed-signal Solution from DOLPHIN Integration and Tanner EDA and Leads Regional User Group to Drive Continued Innovation

Microdul AG– a specialist for high quality semiconductors and micro-systems assembly – has adopted an integrated mixed-signal flow from Dolphin Integration and Tanner EDA. The solution brings together HiPer Silicon, Tanner EDA’s analog design suite, with SMASH, Dolphin Integration’s logic and mixed-signal simulator, to provide an affordable and innovative mixed-signal EDA flow that operates smoothly …

Microdul Adopts Advanced Mixed-signal Solution from DOLPHIN Integration and Tanner EDA and Leads Regional User Group to Drive Continued Innovation Read More »

Dolphin Integration Receives 2011 TSMC IP Partner Award for Analog/Mixed-Signal IP

Dolphin Integration, provider of mixed-signal IP, has received the 2011 TSMC IP Partner Award for Analog/Mixed-Signal IP. The award is based on customer feedback, TSMC 9000 compliance, support and success of the IP. “We are pleased to present this award to Dolphin Integration based on their TSMC9000 compliance and good feedback from customers,” said Suk …

Dolphin Integration Receives 2011 TSMC IP Partner Award for Analog/Mixed-Signal IP Read More »

D&R announces a New release of its IP CRM station deployed by Dolphin integration

At the SoC Day in Shanghai, D&R releases a new version of its IP Provider Station with emphasis on Customer product Delivery management. Gaining from the experiences in advanced product catalogs supporting dedicated views for design and marketing/sales managers, D&R has applied the same flexible formatting technology for creating IP management panels on top of …

D&R announces a New release of its IP CRM station deployed by Dolphin integration Read More »

DOLPHIN Integration and TexEDA Design announce their cooperation, delivering a complete and attractive EDA flow embedding SMASH as LaySim into LayTools

Dolphin Integration SA and TexEDA Design Inc announce today that their EDA solutions for logic & mixed-signal simulation, and for custom integrated circuit design, have been closely coupled and bundled to enable a complete and consistent flow. LaySim is offered within the LayTools IC design suite, as either a comprehensive device-level simulator (Spice compatible) or …

DOLPHIN Integration and TexEDA Design announce their cooperation, delivering a complete and attractive EDA flow embedding SMASH as LaySim into LayTools Read More »

DOLPHIN Integration and Infolytica Corporation enable mechatronic system simulation using MagNet and MotorSolve coupled with SMASH

DOLPHIN Integration SA and Infolytica Corporation announce today that their solutions for mixed signal simulation and electromagnetic field simulation can now work together to perform powerful mechatronic system simulation. SMASH, from DOLPHIN Integration, can directly simulate response surface models of electric motors generated in VHDL-AMS by MagNet or MotorSolve, from Infolytica, and can perform a …

DOLPHIN Integration and Infolytica Corporation enable mechatronic system simulation using MagNet and MotorSolve coupled with SMASH Read More »

Guidelines for Verilog-A Compact Model Coding
Nanotech 2010 Vol. 2, pp. 821-824
G. Depeyrot, F. Poullet and B. Dumas

Guidelines for Verilog-A Compact Model Coding Nanotech 2010 Vol. 2, pp. 821-824, June 2010 G. Depeyrot, F. Poullet and B. Dumas Keywords: Verilog-A, compact model, SPICE Verilog-A has practically become the standard for developing and coding compact device models. However, contrarily to the Verilog standard, where the IEEE has defined syntax and semantic rules for …

Guidelines for Verilog-A Compact Model Coding
Nanotech 2010 Vol. 2, pp. 821-824
G. Depeyrot, F. Poullet and B. Dumas Read More »

Genesys and Dolphin Integration announce their renewed cooperation in the field of microcontroller thanks to the quality of support

Genesys, the Taiwan Fabless Supplier of SoCs for high-speed I/O communication applications, and Dolphin Integration, the provider of high-performance and low-power Virtual Components, announce their cooperation for microcontroller Core. For ensuring a competitive edge on the market of High-speed I/O communication applications, it no longer is sufficient to maximize low cost for the SoCs. I …

Genesys and Dolphin Integration announce their renewed cooperation in the field of microcontroller thanks to the quality of support Read More »

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Category: News releases

New partnerships strengthen the position as prime contractor of Dolphin Integration for the design, the fabrication and the test of custom ASIC/SoC circuits

Dolphin Integration launches the kit of cells to build islets of the second generation

IcyHeart EU project launch: Highly integrated ultra-low-power SoC solution for unobtrusive and energy-efficient wireless cardiac monitoring

Microdul Adopts Advanced Mixed-signal Solution from DOLPHIN Integration and Tanner EDA and Leads Regional User Group to Drive Continued Innovation

Dolphin Integration Receives 2011 TSMC IP Partner Award for Analog/Mixed-Signal IP

D&R announces a New release of its IP CRM station deployed by Dolphin integration

DOLPHIN Integration and TexEDA Design announce their cooperation, delivering a complete and attractive EDA flow embedding SMASH as LaySim into LayTools

DOLPHIN Integration and Infolytica Corporation enable mechatronic system simulation using MagNet and MotorSolve coupled with SMASH

Guidelines for Verilog-A Compact Model Coding
Nanotech 2010 Vol. 2, pp. 821-824
G. Depeyrot, F. Poullet and B. Dumas

Genesys and Dolphin Integration announce their renewed cooperation in the field of microcontroller thanks to the quality of support