Category: News releases

Dolphin Integration enriches its line of 80251 with a new DMA for high density and robustness

Dolphin Integration presents a new peripheral to extend its wide offer for 80251 and 8051 microcontroller. The FlipDMA is proposed with many features, while presenting a small area of 0.03 mm2 for 2 channels on TSMC 0.18 µm G: Choice of number of channels 3 functional transfer modes: burst, alternate cycle, single byte optional features …

Dolphin Integration enriches its line of 80251 with a new DMA for high density and robustness Read More »

Dolphin integration announces one million of circuits sold over the last two years

Dolphin Integration confirm the growth of their Custom Fabless activity for industrial, aeronautical and military markets with the delivery of more than a million devices since June 2011. For the leader in Silicon IP for dense and low-consumption circuits, Custom Fabless Products serve to demonstrate their experience in solving, ahead of any competition, the practical …

Dolphin integration announces one million of circuits sold over the last two years Read More »

Availability of Dolphin Integration’s TSMC-sponsored ROM at the 130 nm BCD 5 V process

The growing demand for BCD technology aims at facilitating the integration of logic and analog with relatively high-voltage features on the same SoC for such volume applications where 5 V is due to the USB standard, enabling embedded power regulators with chargers, as well as higher sound power of Audio DACs. Moving to the 130 …

Availability of Dolphin Integration’s TSMC-sponsored ROM at the 130 nm BCD 5 V process Read More »

With BassPower™ for headphones, Dolphin Integration eliminates up to 80% of external capacitor cost

Adequate IP procurement may serve well for cost reduction on the Bill of Material. For portable devices, such as Smartphones and Tablets, the race to the reduction of device thickness adds constraints on PCB area and package thickness. Dolphin Integration blows it all by providing Audio Codecs with their new BassPower™ headphone feature. This innovation …

With BassPower™ for headphones, Dolphin Integration eliminates up to 80% of external capacitor cost Read More »

Dolphin Integration announces a new generation of ultra-dense standard cell library for GSMC 0.18 µm uLL eFlash process

Dolphin Integration, the leading provider for innovative libraries of standard cells and low-power memories, has released SESAME uHD-BTF, the latest 6-Track architecture of their standard cell family, for cost sensitive designs at GSMC 0.18 mm uLL eFlash process. The launched 6-Track standard cell library reduces silicon costs significantly in comparison with existing libraries. Benchmark results …

Dolphin Integration announces a new generation of ultra-dense standard cell library for GSMC 0.18 µm uLL eFlash process Read More »

Dolphin Integration introduces first successful complete IP offering for Power Metering applications

Dolphin Integration rolls out for Smart Grid applications a complete subsystem: the first Silicon IP combining a Mixed-signal Front End (MFE) with a Power and energy Computation Engine (PCE). The IP enables to achieve a class 0.1% at the system-level with several sensors while targeting a measurement range up to 1/10,000. Indeed, in mastering the …

Dolphin Integration introduces first successful complete IP offering for Power Metering applications Read More »

Dolphin Integration announces the best noise and linearity performances on the market of its circuit for space application

Dolphin Integration demonstrates the excellence of its expertise in design and integration services through the development of a new circuit showing performances never reached. This development was performed in the frame of the preparation of the “Loft mission”, scientific satellite of X-ray detection, in close collaboration with IRAP (Institut de Recherche en Astrophysique et Planétologie) …

Dolphin Integration announces the best noise and linearity performances on the market of its circuit for space application Read More »

Dolphin Integration announces the availability of the new generation of Foundry Sponsored SpRAM generator at 55 nm

Dolphin Integration invites users of the TSMC 55 LP process to try out the latest Foundry Sponsored SpRAM released, known as SpRAM RHEA generator. This SpRAM is designed to reach the highest density and gains from 7% to 20% versus alternative solutions, depending on the memory configuration required. The SpRAM RHEA has now passed the …

Dolphin Integration announces the availability of the new generation of Foundry Sponsored SpRAM generator at 55 nm Read More »

New partnerships strengthen the position as prime contractor of Dolphin Integration for the design, the fabrication and the test of custom ASIC/SoC circuits

Dolphin Integration benefit from more than 25 years of experience in providing with: Virtual components of Immaterial Propriety (Silicon IPs like MCU, standard cells, memories, high-resolution converters) Design services (on-demand ASICs/SoCs, migration from FPGA to ASIC, etc.) Dolphin profile themselves as prime contractor in a genuine "one-stop shop" model by taking in charge the wholeness …

New partnerships strengthen the position as prime contractor of Dolphin Integration for the design, the fabrication and the test of custom ASIC/SoC circuits Read More »

Dolphin Integration launches the kit of cells to build islets of the second generation

Dolphin Integration is releasing SESAME CLICK, a kit of cells enabling the construction and integration of islets. Its low power cells optimized for TSMC 65 nm and 55 nm processes is enriched with a patented Transition Ramp Cell for an easy and safe construction of low energy circuits. SESAME CLICK minimizes power consumption through: Support …

Dolphin Integration launches the kit of cells to build islets of the second generation Read More »