Conference papers Archives - Page 5 of 6 - Accelerate Energy Efficient SoC designs

IP packaging based on XML signatures
IP/SOC 2005
G.Saucier, L.Ghanmi, M.Hamdoun, D.Maurer

Abstract This paper presents “best practice” up to a “standard” for packaging and delivering IP versions/configurations based on “XML signatures”; A XML layer is created on top of the files defining virtual IP version/configurations When delivering an IP to a consumer he gets in addition to the files its “XML signature” providing him a comprehensive […]

IP packaging based on XML signatures
IP/SOC 2005
G.Saucier, L.Ghanmi, M.Hamdoun, D.Maurer Read More »

An Analog Front-End for Remote Sensor applications with High Input Common-Mode Rejection including a 16bit ΣΔ ADC in 0.35μm 3.3V CMOS process
ESSCIRC (2004)
E.Compagne, S.Maulet, S.Genevey

Abstract Data acquisition through remote sensors can be exposed to very high electrical noise sources because sensors wiring act like antenas for noise. Aircrafts are particularly exposed to EMI, RFI radiations and IxR ground loop… Download this press release

An Analog Front-End for Remote Sensor applications with High Input Common-Mode Rejection including a 16bit ΣΔ ADC in 0.35μm 3.3V CMOS process
ESSCIRC (2004)
E.Compagne, S.Maulet, S.Genevey Read More »

The Awaited Standards for safe integration of mixed signal Virtual Components into logic systems
IC China
J.F.Pollet

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The Awaited Standards for safe integration of mixed signal Virtual Components into logic systems
IC China
J.F.Pollet Read More »

Mixed signal Virtual Components: the challenges
8th IEEE International Mixed-Signal Testing Workshop (IMSTW 2002)
J.F.Pollet

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Mixed signal Virtual Components: the challenges
8th IEEE International Mixed-Signal Testing Workshop (IMSTW 2002)
J.F.Pollet Read More »

Simulation eines Kfz-Energienetzes mit elektrischen und elektromechanischen VHDL-AMS Komponentenmodellen
Workshop der Arbeitsgemeinschaft Simulation (ASIM) Fachgruppe 4.5 – Simulation technischer Systeme (STS)
D.Dammers, L.M.Voßkämper, Bielefeld

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Simulation eines Kfz-Energienetzes mit elektrischen und elektromechanischen VHDL-AMS Komponentenmodellen
Workshop der Arbeitsgemeinschaft Simulation (ASIM) Fachgruppe 4.5 – Simulation technischer Systeme (STS)
D.Dammers, L.M.Voßkämper, Bielefeld Read More »

A GSM receiver base band in 0.25m, 1.8V fully depleted SOI including a 4th order serial DS A/D converter
ESSCIRC (2001)
E.Compagne, J.Sevenhans, C.Raynaud

Abstract SOI technology is very promising for digital low voltage low power devices, but radio integration requires also the base band analog and the RF circuits to be realised in the same technology for a single chip radio. In the analog circuits we learn to live with the kink effect and in the RF we

A GSM receiver base band in 0.25m, 1.8V fully depleted SOI including a 4th order serial DS A/D converter
ESSCIRC (2001)
E.Compagne, J.Sevenhans, C.Raynaud Read More »

Universelle Modellierung mikromechanischer Strukturen für den Einsatz in Systemsimulationen
Vortrag ASIM Workshop Modellierung und Simulation technischer Systeme, Dresden, Germany
L.M.Voßkämper, R.Schmid, G.Pelz

Abstract Im Gegensatz zu klassischen objekt-orientierten Modellierung mikromechanischer Strukturen, wie zum Beispiel bei der Beschreibung von Platten, Aufhängun- gen, Antrieben, etc. [4], stellt diese Arbeit die Kombination von Modellen physikalischer Basiseffekte zu Objektmodellen vor, welche für eine Systemmodellierung geeignet ist. Dies erlaubt eine freie Wahl der Effekte, die bei der Simulation berücksichtigt werden sollen. Darüber

Universelle Modellierung mikromechanischer Strukturen für den Einsatz in Systemsimulationen
Vortrag ASIM Workshop Modellierung und Simulation technischer Systeme, Dresden, Germany
L.M.Voßkämper, R.Schmid, G.Pelz Read More »

Modeling Micro-Mechanical Structures for System Simulations
Forth International Forum on Design Languages (FDL) (2001), Lyon, France
L.M.Voßkämper, R.Schmid, G.Pelz

Abstract In contrast to classical object-oriented electromechanical modeling, i.e. describing plates, suspensions, drives etc., this paper proposes to combine models of basic physical effects to object models which in turn can be used for system modeling. This allows to freely choose which effects are to be considered for some simulation. Moreover, the development of new

Modeling Micro-Mechanical Structures for System Simulations
Forth International Forum on Design Languages (FDL) (2001), Lyon, France
L.M.Voßkämper, R.Schmid, G.Pelz Read More »

Challenges in mixed-signal design for the SoC area
Date Conference, München, Germany (2001)
J.F.Pollet

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Challenges in mixed-signal design for the SoC area
Date Conference, München, Germany (2001)
J.F.Pollet Read More »

Combining Models of Physical Effects for Describing Complex Electromechanical Devices
EEE/ACM International Workshop on Behavioral Modeling and Simulation (BMAS), Orlando, Florida, USA
L.M.Voßkämper, R.Schmid, G.Pelz

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Combining Models of Physical Effects for Describing Complex Electromechanical Devices
EEE/ACM International Workshop on Behavioral Modeling and Simulation (BMAS), Orlando, Florida, USA
L.M.Voßkämper, R.Schmid, G.Pelz Read More »

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Conference papers

IP packaging based on XML signatures
IP/SOC 2005
G.Saucier, L.Ghanmi, M.Hamdoun, D.Maurer

An Analog Front-End for Remote Sensor applications with High Input Common-Mode Rejection including a 16bit ΣΔ ADC in 0.35μm 3.3V CMOS process
ESSCIRC (2004)
E.Compagne, S.Maulet, S.Genevey

The Awaited Standards for safe integration of mixed signal Virtual Components into logic systems
IC China
J.F.Pollet

Mixed signal Virtual Components: the challenges
8th IEEE International Mixed-Signal Testing Workshop (IMSTW 2002)
J.F.Pollet

Simulation eines Kfz-Energienetzes mit elektrischen und elektromechanischen VHDL-AMS Komponentenmodellen
Workshop der Arbeitsgemeinschaft Simulation (ASIM) Fachgruppe 4.5 – Simulation technischer Systeme (STS)
D.Dammers, L.M.Voßkämper, Bielefeld

A GSM receiver base band in 0.25m, 1.8V fully depleted SOI including a 4th order serial DS A/D converter
ESSCIRC (2001)
E.Compagne, J.Sevenhans, C.Raynaud

Universelle Modellierung mikromechanischer Strukturen für den Einsatz in Systemsimulationen
Vortrag ASIM Workshop Modellierung und Simulation technischer Systeme, Dresden, Germany
L.M.Voßkämper, R.Schmid, G.Pelz

Modeling Micro-Mechanical Structures for System Simulations
Forth International Forum on Design Languages (FDL) (2001), Lyon, France
L.M.Voßkämper, R.Schmid, G.Pelz

Challenges in mixed-signal design for the SoC area
Date Conference, München, Germany (2001)
J.F.Pollet

Combining Models of Physical Effects for Describing Complex Electromechanical Devices
EEE/ACM International Workshop on Behavioral Modeling and Simulation (BMAS), Orlando, Florida, USA
L.M.Voßkämper, R.Schmid, G.Pelz

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