“Development of High-Performance and Reliable Next-Generation Systems Based on Emerging MEMS Technology”
GSA Forum

Microelectromechanical systems (MEMS) are finally becoming attractive for many industrial applications; their potential range of use is continuously increasing. The next generation of industrial applications will require optimal systems with high resolution, miniaturization and reliability, thereby forcing system integrators to combine both sensors and application-specific ICs (ASICs) in a feedback arrangement implemented as a system-in-package (SiP).

The real challenge consists in guaranteeing performance and yield for the SiP. As high-performance multi-domain systems slowly emerge, innovation and new design techniques are required to reach robustness and testability goals.

This article presents a method which can be used to guarantee that the multi-domain system will be in conformance with its specification and explains why performing an assessment of a virtual fabrication process is mandatory to evaluate robustness and reliability. It describes a design chain that can be used to ensure the correlation between simulations and silicon measurements of a multi-domain system…

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