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Conference papers

Power Islets: Design Methodology and Innovative Silicon IPs to Solve the Construction Quandary
TSMC 2013 Open Innovation Platform® Ecosystem Forum
E.Bernard-Moulin, G.Depeyrot

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Conference papers

New struggle on multimedia Audio Converters: How Dolphin Integration reduced the fabrication costs?
IP SoC Days Shanghai & IP SoC Days Beijing
V.Richard, Y.Zhao

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Technical papers

True non-intrusive sensors for RF built-in test
Test Conference (ITC), 2013 IEEE International
L.Abdallah, TIMA Lab. Grenoble INP-UJF France, H.G.Stratigopoulos, S.Mir

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Dolphin Integration enriches its line of 80251 with a new DMA for high density and robustness

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Dolphin integration announces one million of circuits sold over the last two years

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Availability of Dolphin Integration’s TSMC-sponsored ROM at the 130 nm BCD 5 V process

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With BassPower™ for headphones, Dolphin Integration eliminates up to 80% of external capacitor cost

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Dolphin Integration announces a new generation of ultra-dense standard cell library for GSMC 0.18 µm uLL eFlash process

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A french company on strategic sector: Virtuals components
L’hebdo-BOURSE PLUS

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Page 30 of 47

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