IP packaging based on XML signaturesIP/SOC 2005G.Saucier, L.Ghanmi, M.Hamdoun, D.Maurer
Abstract This paper presents “best practice” up to a “s […]
IP packaging based on XML signaturesIP/SOC 2005G.Saucier, L.Ghanmi, M.Hamdoun, D.Maurer Read More »
Conference papers
An Analog Front-End for Remote Sensor applications with High Input Common-Mode Rejection including a 16bit ΣΔ ADC in 0.35μm 3.3V CMOS processESSCIRC (2004)E.Compagne, S.Maulet, S.Genevey
Abstract Data acquisition through remote sensors can be
A GSM receiver base band in 0.25m, 1.8V fully depleted SOI including a 4th order serial DS A/D converterESSCIRC (2001)E.Compagne, J.Sevenhans, C.Raynaud
Abstract SOI technology is very promising for digital l
Universelle Modellierung mikromechanischer Strukturen für den Einsatz in SystemsimulationenVortrag ASIM Workshop Modellierung und Simulation technischer Systeme, Dresden, GermanyL.M.Voßkämper, R.Schmid, G.Pelz
Abstract Im Gegensatz zu klassischen objekt-orientierte
Modeling Micro-Mechanical Structures for System SimulationsForth International Forum on Design Languages (FDL) (2001), Lyon, FranceL.M.Voßkämper, R.Schmid, G.Pelz
Abstract In contrast to classical object-oriented elect
