TSMC Open Innovation Platform Ecosystem Forum – North America

Come and visit us at our booth !

TSMC Open Innovation Platform Ecosystem Forum – North America

October 26, 2022
Santa Clara, CA

Join the Dolphin Design team at the TSMC 2022 Open Innovation Platform Ecosystem Forum and find out how we can help you with our Power Management, Audio and Processings IPs to solve your design challenges!

During the Partner Technical Session, we will deliver a talk on “Breakthrough platforms for AIoT markets – Democtratize Energy-Efficient Ambient Computing

At the TSMC OIP NA event, learn in particular about:

  • Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies
  • Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications
  • Updated design solutions for specialty technologies enabling ultra-low voltage, analog migration, mmWave RF, and automotive designs targeting automotive and IoT designs
  • Ecosystem-specific TSMC reference flow implementations, P& R optimization, machine learning to improve design quality and productivity, and cloud-based design solutions
  • Successful, real-life applications of design technologies and IP solutions from ecosystem members and TSMC customers

We look forward to seeing you at the 2022 TSMC OIP Ecosystem Forum!

Meet the team

Meet our team and discover our full catalog of TSMC products.

Frederic Renoux

Fréderic RENOUX

EVP of Sales



Sales Director - Americas

Do want to know more about our solutions in processing with a focus on power management?

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