FD-SOI Adaptive Body Bias Solutions to accelerate energy-efficient SoC designs

Come at ChipEx to listen to Pierre Gazull, our Business Developer for IoT

International Reliability Physics Symposium – April 31-04, 2019

March 31, 2019
Monterey, United States

Meet our technical team all along the event :

Vincent Huard

Vincent Huard


On March 31 at 01:30 PM, Vincent will present a tutorial with Joerg Winkler, from GLOBALFOUNDRIES “Dynamic aging compensation – the next key enabler of automotive products “

Lionel Jure

Lionel Juré

Research & Architecture Manager

Nicolas Gaude

Nicolas Gaude

Automotive Business Developer

Nicolas Gaude

Business Developer for Automotive
Phone: +33 480 420 724

Dynamic aging compensation - the next key enabler of automotive products

The automotive products, driven by ADAS needs, are now moving to very advanced CMOS nodes. This trend is helping a lot from soft errors perspective with a reduced architectural cost to achieve required FIT rate. But, on another hand, this trend is also generating enhanced risk with respect to end-of-life electrical wearout. Though such mechanisms can be managed statically with larger design margins, this is now often not possible in a context where leakage must also be reduced to support even higher junction temperatures. New solutions as dynamic aging compensation have been considered for the last decade as a research topic. But some groups are now moving towards an industrial usage of such dynamic aging compensation. This tutorial will guide you through the different research findings over the last decade and will give you clues on the most advanced solutions that will come in the next generation of automotive products.